Since the mainstream of the new IC’s chip package is shifting to BGA package from CBGA, CCGA, CSP, QFN, MLF, it becomes more difficult to do rework or repair on defective devices. Compared to said old type packages, BGA package’s soldering points, a large number of solder balls, located under the bottom of the package and it hinders visual inspection as well a touch up rework. The only possible way to rework/repair already processed BGA package on board is detaching it from board. However, once it is removed from the board then it solder balls are damaged and cannot be used unless damaged balls are replaced. Expert Institute offers all the necessary processes from detaching to testing to make BGA package with damaged solder ball reusable and as reliable as new one. We are the authorized distributor for BGA MACHINE.
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